Process Capability
Item | PCB | FPC | MCPCB |
---|---|---|---|
Layer Count | 1~52 layer | 1~8 layer | 1~8 layer |
Type | Single、Double、Multilayer、1~4Blind Via and Buried Via | Single、Double、Multilayer、Rigid-flex board | Single、One Side Double Panel、Metal Sandwich Panel |
Material Type |
CEM、FR4、FR5... Glass fiber material |
2Layer or 3Layer... PI | Aluminum、Copper |
Finished board thickness | 0.1~6.35mm | 0.1~0.3mm | 0.6~2.0mm |
Typesetting Area | 510*750mm(max) | 250*550mm(max) | 510*610mm(max) |
Inner Layer Line Width/Space | Line Width/Space=>2mil/2mil | Line Width/Space=>3mil/3mil | Line Width/Space=>4mil/4mil |
Max. finished copper thickness | 0.5oz~5oz | 0.5oz~2oz | 1oz~3oz |
PTH |
ø=2mil ±2mil |
ø=3mil ±3mil |
ø=6mil ±3mil |
Outer Layer Line Width/Space |
Line Width/Space=>2mil/2mil | Line Width/Space=>3mil/3mil | Line Width/Space=>4mil/4mil |
Solder Mask |
Thickness 0.7~1.5mil Minimum dam/bridge 3mil The tolerance of soldermask exposure registration 2mil |
Thickness 0.4~0.7mil Minimum dam/bridge 3mil The tolerance of soldermask exposure registration 3mil |
Thickness 0.7~1.5mil Minimum dam/bridge 3mil The tolerance of soldermask exposure registration 3mil |
Silk Legend | Line width 4mil(min) | Line width 5mil(min) | Line width 5mil(min) |
Surface Metalized | Lead-Free HASL、ENIG、Flash Gold、Immersion Silve、Silver plating、OSP | ENIG、Flash Gold、Immersion Silve、Silver plating、Tin plating、OSP | Lead-Free HASL、ENIG、Flash Gold、Silver plating、OSP |
NPTH |
ø=1.0~6.5mm Offset±2mil Hole Tolerance ±2mil |
ø=1.0~6.5mm Offset±2mil Hole Tolerance ±2mil |
ø=1.0~6.5mm Offset±2mil Hole Tolerance ±2mil |
Router | CNC、Molding、V-cut | Die、Etrching die、Steel mold | CNC、Molding、V-cut |
Test O/S | O/S Test | O/S Test | O/S Test |
Final Inspection | Finished product inspection specification | Finished product inspection specification | Finished product inspection specification |
Packing | Vacuum bubble bag | Zipper、Tray | Vacuum bubble bag、Tag |